| 시간 |
세부내용 |
강사 |
|
09:30 - 09:40
|
Opening talks for the 3rd symposium on micro joining and electronic packaging technology, korea |
Prof. Y. E. Shin
President of Korea Micro
|
|
09:40 - 10:40
|
Basic Characteristics of Lead-free Solders and Trends for standardization of Their Evaluation Methods in Japan
1. Outline of Lead-free Solders
2. Basic Characteristics and Subjects
3. Research and Development of Lead-free Solders in the World
4. Lead-free Solder Projects
5. Standardization of Evaluation Methods of Lead-free Solders in Japan
6. Test Methods |
Prof. T. Takemoto
Honour Chairperson,
Osaka university
|
|
10:40 -11:20
|
Transition & corresponding direction of the Electronic Packaging technology in the digital era
(디지털 시대의 실장기술의 가치 변화와 대응 방향)
1. Introduction 2. Product's circumstance in the digital era
3. Transition of the production value 4. Corresponding direction
5. Conclusions |
I. J. Cho
LG Production engineering
Research Center
Chief Research Engineer
|
|
11:20 - 11:30
|
Coffee Break
|
|
11:30 - 12:30
|
Evaluation of reliability of QFP joints soldered with Sn-Zn-Bi based
lead-free solder
1. lead free materials 2. stress tests
3. evaluation method 4. evaluation items |
S.Fujiuchi
SCI Technologies Japan,Ltd, Japan IBM
|
|
12:30 - 13:30
|
Lunch time
|
|
13:30 - 14:10
|
Review on the Application of Lead-Free Soldering for Electronic Components
(전자부품에서의 Pb-Free 솔더링의 적용) |
C. S. Yoo
General Manager
Material Research Lab.
R&D Center Samsung Electro-mechanics
|
|
14:10 - 15:10
|
Theoretical Approach to Clarify Dominant Parameter Ruling Thermal Stress in Array of Dissimilar Material Joints |
Prof. T. Akiyama
Kyushu Institute of Technology
|
|
15:10 - 16:10
|
The current status of lead-free soldering material and process in Japan
1. Lead-Free Soldering Materials
...ㆍLead-Free Solder Alloys
...ㆍLead-Free Solder Paste
...ㆍLead-Free Cored Wire Solder
...ㆍFluxes For Lead-Free Flow Soldering
2. Lead-Free Soldering Equipment
...ㆍReflow Soldering ...ㆍHand Soldering ...ㆍFlow Soldering |
T. Hori
Senju Metal Industry Co
|
|
16:10 - 16:20
|
Coffee Break
|
|
16:20 - 17:00
|
Selective Soldering Using Composite Solder Pallets (Point Soldering기술)
1. Composite Materials 2. Applications of composite materials
3. Selective Soldering Methods
4. PCB design quidelines for Selective Solder Pallets
5. Selective Solder Pallet Design 6. Future trends |
K. Munro Product Manager
Permali Composites Sa France
|
|
17:00 - 17:40
|
Flip chip and bumping technology for chip scaled image sensor module
1. Flip chip bumping technology
2. Bumping requirements for Electronics
3. Image sensor packaging |
J. H. Kim
Manager of Research & Development
Semiconductor Division,
Ccube Digital Co., Ltd.
|
International Symposium on Micro-Joining and Electronics Packaging Technology
